Printed Circuit Boards


Printed Circuit Board Assembly
Surface Mount Technology (SMT)

  • Medium volume orders offer high flexibility with very low cost per placement
  • SMT placement capabilities for fine pitch TQFP and 0402 chip preset
  • Thick Film Hybrid circuit manufacturing
  • Complex double-sided PCB assembly
  • Flexible circuit assembly
  • Custom labeling
  • Burn-in
  • High density component placement capability
  • Low cost per placement
  • Various Wave Flow soldering techniques
  • Test capabilities available such as In-circuit, Functional and Power-Up tests
  • Assembled under environmentally controlled antistatic manufacturing conditions
  • Focused lines, which fit the process to the product and customer need
  • Functional and conformance standards such as IPC
  • Complete in-house circuit design and layout services